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EPOXY SYSTEMS TO BE CURED AT HIGH TEMPERATURE IN OVEN -  CURED STATE: RIGID

 

More than 100Kg per order only!!!   

PART NUMBER

FILLED

 

TYPICAL APPLICATION
 

To ask

info

offer

CE 1900

Yes

ENCAPSULATION AND VACUUM SEALING FOR CLASS F COMPONENTS.

CE 2000

No

ENCAPSULATION AND SEALING FOR CLASS F COMPONENTS.

CE 2000H

No

 

ENCAPSULATION AND SEALING FOR CLASS H COMPONENTS. GLASS TRANSITION TEMPERATURE (Tg): 160°C
 

CE 2000H / AE

Yes

 

SELF-ESTINGUISHING VERSION OF THE PREVIOUS ONE.
                            

CE 1000-800

Yes

 

COMPOUND FOR THE PRODUCTION OF FILTERING SINTER.
 

CE 666L

No


SINGLE-COMPONENT RESIN FOR ENCAPSULATION AND SEALING OF ELECTRIC COMPONENTS.
 


CE 666
 

Yes

SINGLE-COMPONENT RESIN FOR ENCAPSULATION AND SEALING OF ELECTRIC COMPONENTS.